Battery power consumption is one of the important requirements that determine the driving distance on a single charge. In order to reduce the power consumption, it is critical to reduce the overall weight of automobile parts.
The next-generation WICOP UHL (Ultra High Luminance) Series LEDs exhibit up to 40% better heat dissipation performance than other products in the current LED market. By applying WICOP UHL to automobile headlamps, the weight of lamp heat sink structure can be reduced by 75%. The LED emitting area of the product is extremely small approximately 0.5mm2, which enables a slim headlamp design. This new LED technology completely compensates for the disadvantages of heat dissipation, as the lighting emitting area is smaller, and thus it enables not only slim lamp design but also high performance.
The weight of lamp heat sink structure can be reduced by 75% and the structure of Mini LED patented technology Several companies' products described as a Flip Chip are copying Seoul's WICOP patented technology.
WICOP (Wafer Integrated Chip on PCB), a fundamental technology of the new product, is the world's first patented package-less LED technology developed by Seoul Semiconductor. Unlike flip chip technology that must be bonded in the semiconductor process, WICOP LEDs can be easily surface-mounted (SMT) in the general substrate bonding process. Mini LEDs also use the WICOP technology with a robust structure.
"This new product will be mass-produced from 2021 according to requests of global headlamp manufacturers. And it can be adopted for headlamps of all automobile brands and designs," said representative of Seoul Semiconductor.
The company will begin mass production in 2021 and with promotions to key customers.
Source: Seoul Semiconductor